ChipXcel combines decades of semiconductor expertise with next-gen tech in Assembly, Testing, Marking, and Packaging.
Ensure 99.9% chip reliability.
Custom high-precision solutions.
Scalable assembly lines.
Traceability with laser & ink.
Automotive
Telecom
IoT
Consumer Electronics
Medical
Industrial
Driving chip innovation.
Robotic precision.
Zero-defect protocols.
Efficient distribution.
Singapore facility.
Germany line.
US & India.
IPO & Nasdaq.
“Testing solutions transformed reliability.”
— John Doe“Packaging saved 20% costs.”
— Sarah Lee“Assembly gave edge.”
— Michael Smith