ATMP & OSAT Solutions · Global Scale
Your semiconductor final-stage solutions, redefined.
ChipXcel is a next-generation semiconductor ATMP company combining decades of expertise with advanced technology in Assembly, Testing, Marking, and Packaging — the final-stage layer that determines whether a chip performs, survives in the field, and reaches its destination on time.
Flip-chip bonding, wafer-level packaging (WLP), and System-in-Package (SiP) solutions — adapting to your exact complexity and volume demands.
Robotic assembly lines with AI-assisted quality control and closed-loop process control — reducing cycle times by up to 35% while eliminating variability.
Machine vision, deep learning defect classification, and statistical process control at every stage — with real-time yield dashboards for full visibility.
End-to-end semiconductor final-stage processing — handled with uncompromising precision from wafer to finished device.
Functional, electrical, and parametric validation across temperature extremes using AI-assisted ATE systems — consistently achieving 99.9% yield rates.
ATE · AI-AssistedFrom QFN and BGA to flip-chip, WLP, and SiP — every package hermetically sealed and thermally optimised for longevity in any operating environment.
Flip-Chip · WLP · SiPFully robotic, high-mix high-volume assembly lines. Our infrastructure flexes with your demand — processing millions of units per day without sacrificing precision.
High-Mix · High-VolumeUltra-fine laser and ink-jet marking compliant with AEC-Q100, JEDEC, and MIL-STD standards — complete lot traceability from wafer to field.
Laser · AEC-Q100Delivering critical semiconductor solutions across the world's most demanding sectors.
ADAS, EV powertrains, and in-vehicle compute — where failure is not an option.
Base stations, network infrastructure, and RF chips for the global 5G rollout.
Ultra-low-power chips for billions of connected edge devices worldwide.
High-volume packaging for smartphones, wearables, and next-gen computing.
Mission-critical chips for imaging, implantables, and patient monitoring systems.
Ruggedised packaging for harsh environments and secure defence electronics.
Four integrated capabilities that define our competitive advantage — and most ATMP providers haven't yet mastered.
Active R&D in next-gen packaging — 3D heterogeneous integration, chiplet interconnects, and photonic packaging for AI and HPC applications.
Fully automated production floors from die attach to tape-and-reel — reducing cycle times by up to 35% and eliminating human-induced variability.
Machine vision and SPC integrated at every production stage. Real-time yield dashboards give customers full visibility into their output at all times.
Multi-continent facility strategy designed for supply chain resilience — geographic redundancy and shorter time-to-market across all major regions.
The global semiconductor market is projected to reach $1 trillion by 2030. ATMP and OSAT services are the fastest-growing segment — and ChipXcel is purpose-built to capture it.
99.9% yield rates backed by years of process refinement — a durable advantage that scales without quality degradation.
AI accelerators, EVs, 5G, and IoT proliferation are creating sustained, inelastic demand for advanced semiconductor packaging.
Modular facility architecture — each new facility designed to reach operational profitability within 18 months of commissioning.
Facilities across Singapore, Germany, US, and India offer supply chain resilience in a world reducing single-geography chip dependency.
A disciplined, phased path to becoming a top-tier global ATMP and OSAT provider — with a Nasdaq IPO as the destination.
Asia-Pacific hub near the established semiconductor ecosystems of Taiwan, Malaysia, and South Korea.
European automotive-grade production line serving Tier-1 OEMs and industrial clients across the region.
Dual expansion capturing CHIPS Act momentum in the US and India's growing ATMP ecosystem.
Targeting a Nasdaq listing — delivering a structured liquidity event for early investors with validated global positioning.
ChipXcel is being built to meet the expectations of the world's most demanding semiconductor clients. Here is the bar we are committed to delivering.
"Our target for every packaging partner is simple — zero field returns, full lot traceability, and the ability to scale within weeks, not quarters. These are the benchmarks ChipXcel is engineered to meet."
Quality Standard · Automotive-Grade Expectation"The ATMP partners that win long-term contracts bring packaging innovation, not just capacity. ChipXcel is being built to solve complex form-factor challenges and deliver measurable cost reduction for every client."
ChipXcel Commitment · Our Promise"Supply chain resilience is a board-level priority. Our multi-continent model exists to give clients the geographic redundancy that single-location ATMP providers simply cannot offer."
Supply Chain · Core Design Philosophy